Leaked conversations between Qualcomm and its Korean partners have revealed that the Snapdragon 8 Gen 3 chipset will comprise both the faster 3nm (N3E) and the less expensive 4nm (N4P) process variants developed by TSMC, tech media outlet IThome reported on Tuesday. The Snapdragon 8 Gen 3 processor is expected to adopt a 2+4+2 design, which gives it two Cortex X4 cores, four Cortex A720 cores, and two Cortex A520 cores, the report added. The Qualcomm Snapdragon 8 Gen 3 will launch on October 24 at the Snapdragon Summit 2023 in Hawaii, US. It is still unclear whether the distinction between the two TSMC variants of the Snapdragon 8 Gen 3 will be unveiled separately. [IThome, in Chinese]
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