Samsung Electronics is creating a brand new glass substrate for superior semiconductor packaging that could possibly be launched by 2028, in keeping with a report. As demand for AI chips continues to rise, the South Korean tech conglomerate is claimed to be exploring the usage of a glass substrate (as a substitute of silicon) to scale back manufacturing prices, whereas enhancing total efficiency. Samsung is reportedly creating smaller panel prototypes at the price of manufacturing effectivity, as a part of its efforts to be the primary to introduce this expertise.

Samsung to Put together Glass Interposers for AI Chips With Panel-Degree Packaging

Citing trade sources, ETNews reviews (in Korean) that Samsung is ramping up efforts to develop prototypes that use glass substrates for interposers in its AI chips. Present semiconductors are constructed utilizing a 2.5D packaging format, the place the high-bandwidth reminiscence (HBM) surrounds the GPU, related by a silicon interposer.

Not like current chips that use silicon interposers, chipmakers can use glass interposers for 3D stacking of chiplets which might be embedded within the substrate, together with chiplets stacked on high of them. The usage of glass reportedly leads to a slight increase in temperatures, however the advantages embody elevated space, sign, energy, and thermal integrity.

Nonetheless, these silicon interposers are extraordinarily costly to supply, which has prompted chipmakers to discover the usage of glass interposers, in addition to the eventual use of glass substrates. As an alternative of utilizing 510×510mm glass panels like Intel or AppSolix (SKC), Samsung is claimed to be utilizing smaller items which might be smaller than 100×100mm. 

As per the report, these chips may not be environment friendly to supply, however they may assist Samsung be one of many first to launch AI chips that provide improved efficiency whereas additionally being simpler to supply. Manufacturing is anticipated to start at Samsung’s Cheonan facility, utilizing its current panel-level packaging (PLP) as a substitute of wafer degree packaging (WLP).

Samsung is not the one semiconductor producer engaged on changing silicon substrates with glass, as per the report. In response to an older Financial Day by day Information report (in Korean), TSMC can be developing a 300×300mm panel on a pilot line in Taiwan, and the corporate is anticipated to start manufacturing utilizing its Fan-Out Panel-Degree Packaging (FOPLP) in 2027.

Within the claims made by the South Korean information publication are correct, Samsung and TSMC could possibly be one of many first chipmakers to introduce superior AI chips constructed utilizing glass interposers as a substitute of silicon. These chips could possibly be launched as quickly as 2028, whereas work on constructing chips with glass substrates may arrive within the coming years.